CIN::APSE® solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications. CIN::APSE® is the most widely implemented crimpless and solderless, high speed, interconnect in the industry. The simple 2-piece, patent protected design enables 50+ Gbps, and wide range of profiles from 0.020” (0.5mm) to 1.0” (25mm). CIN::APSE® contacts are available in 0.020” (0.5mm) and 0.039” (1.0mm) diameters with a standard pitch of 0.039” (1.0mm) or greater. The number of contacts is not limited and the largest connector implemented to date contained 7,396 I/Os. Solderless termination is achieved through compression and the unique contact design assures multiple points of contact per I/O. The CIN::APSE® interconnects have proven reliability under the most extreme mechanical shock and vibration.