As spectrum utilization increases, it is no longer possible to simply avoid interference caused by passive intermodulation (PIM). Next-generation networks, especially 5G, need stronger protection to help maintain network performance and reliable service for your customers.

The new 3M™ PIM Reduction Kit 1300 is a solution for today’s biggest signal integrity challenges. Combining 3M’s trusted expertise in EMI/EMC applications and adhesives, this out-of-the-box solution helps you reduce conducted PIM without significantly increasing costs, labor or disruptive downtime.

The 3M™ PIM Reduction Kit 1300 is made up of three layers, each developed through 3M science:

 1. 3M™ External PIM Absorber 1000: Composite material consisting of a carrier resin, magnetic fillers and an acrylic pressure sensitive adhesive (PSA)

2. Scotch® Linerless Rubber Splicing Tape 130C: Provides electrical and mechanical protection with the combination of an aggressive rubber resin adhesive and a self fusing, ethylene propylene backing.

3. “Do Not Remove” Label: Informs technicians that the layers of tape shouldn’t be removed during maintenance tasks

3M and Scotch are trademarks of 3M.

www.3m.co.uk/3M/en_GB/p/d/b5005456005/