CIN::APSE® solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications. CIN::APSE® is the most widely implemented crimpless and solderless, high speed, reliable interconnect in the industry. The simple 2-piece, patent protected design enables 50+ Gbps, and wide range of profiles from 0.020” (0.5mm) to over 1.0” (25mm). The number of contacts is unlimited, and the largest connector implemented to date contained 7,396 contacts! The unique contact design assures multiple points of contact in each position and have proven reliability under the most extreme mechanical shock and vibration.